TPS62361BYZHT datasheet(32/52 Pages) TI

32 / 52 page

TPS62360, TPS62361B, TPS62362

SLVSAU9A

– MAY 2011 – REVISED AUGUST 2011

www.ti.com

Table 8. List of Recommended Inductors

SATURATION

CURRENT RATING

INDUCTANCE

DIMENSIONS

DC RESISTANCE

(30% inductance

TYPE

MANUFACTURER

[

µH]

L x W x H [mm3]

Ω typ]

drop, typ)

[A]

1.0

3.4

3.2 x 2.5 x 1.2

PST032251B-1R0MS-11

Cyntec

1.0

3.9

3.2 x 2.5 x 1.0

DFE322510C1276AS-H-

Toko

1R0N(1)

1.0

4.6

3.2 x 2.5 x 1.2

DFE322512C1277AS-H-

Toko

1R0N(1)

1.0

3.8

2.5 x 2.0 x 1.2

DFE252012C1239AS-H-

Toko

1R0N=P2

1.0

5.4

4 x 4 x 2.1

XFL4020-102ME1.0

Coilcraft

1.0

5.4

3.2 x 3 x 1.2

SPM3012T-1R0M

TDK

(1)

Release planned for Q4/2011. Contact manufacturer for details.

OUTPUT CAPACITOR SELECTION

The unique hysteretic control scheme allows the use of tiny ceramic capacitors. For best performance, ceramic

capacitors with low ESR values are recommended to achieve high conversion efficiency and low output voltage

ripple. For stable operation, X7R or X5R type capacitors are recommended.

The TPS6236x is designed to operate with an output capacitor of 10

µF to 22µF, placed at the device's output. In

addition a 0.1

µF capacitor can be added to the output to reduce the high frequency content created by a very

sudden load change.

At light loads, if the device is operating in PFM Mode, choosing a higher value will minimize the voltage ripple

resulting in a better DC output accuracy.

Buffering the processor input by an additional ceramic capacitor in the range of 10

µF to 22µF improves the

voltage quality at the processor input and the dynamic load step behavior. This is especially true if the trace

between the TPS6236x and the microprocessor is longer than the smallest possible. This additional capacitor

needs to be taken into account for the recommended capacitance value. For stability, the sum of the VOUT

capacitors should not exceed 75

µF effective capacitance.

Table 7 shows a list of tested capacitors. The TPS6236x is not designed for use with polymer, tantalum, or

electrolytic output capacitors.

OUTPUT FILTER DESIGN

The inductor and the output capacitor build the output filter. The load might be buffered with an input capacitor

CLOAD, which needs to be factored in. Based on the output capacitor and inductance recommendation sections

and factoring in CLOAD, these components should be in the range:

•

COUT + CLOAD= 10µF to 75µF

•

L = 1

µH

For further performance or specific demands, these values might be tweaked. In any case, the loop stability

should be checked since the control loop stability might be affected.

THERMAL AND DEVICE LIFE TIME INFORMATION

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the

power-dissipation limits of a given component.

Thermal performance can be enhanced by proper PCB layout. Wide power traces come with the ability to sink

dissipated heat. This can be improved further on multi layer PCB designs with vias to different layers.

Proper PCB layout with focus on thermal performance results in a reduced junction-to-ambient thermal

resistance

θJA and thereby reduces the device junction temperature, TJ.

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Product Folder Link(s): TPS62360 TPS62361B TPS62362

TPS62361BYZHT Datasheet(PDF) 32 Page - Texas Instruments

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