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WM8310 Datasheet(PDF) 288 Page - Wolfson Microelectronics plc

Part # WM8310
Description  Processor Power Management Subsystem
PDF  291 Pages
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Manufacturer  WOLFSON [Wolfson Microelectronics plc]
Direct Link  http://www.wolfsonmicro.com
Logo WOLFSON - Wolfson Microelectronics plc

WM8310 Datasheet(HTML) 288 Page - Wolfson Microelectronics plc

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WM8310
Pre-Production
w
PP, May 2012, Rev 3.1
288
31 PACKAGE DIAGRAM
DM062.C
B: 169 BALL BGA PLASTIC PACKAGE 7 X 7 X 1.2 mm BODY, 0.50 mm BALL PITCH
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.
3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.
4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
8. FALLS WITHIN JEDEC, MO-195
3
Y
Z
ccc
X
DETAIL 1
SOLDER BALL
b
Z
ddd
DETAIL 2
A1
Z
aaa
Z
bbb
Z
1
A1
CORNER
TOP VIEW
E
Z
0.10
2 X
D
5
4
DETAIL 2
A
A2
2
Z
0.10
2 X
DETAIL 1
e
BOTTOM VIEW
6
1
9876
54
32
10
11
12
13
A
D
C
B
J
H
G
F
E
K
L
M
N
e
E1
D1
SIDE VIEW
A1
0.21
0.11
b
D
D1
E
E1
e
0.30
0.20
7.00 BSC
6.00 BSC
0.50 BSC
7.00 BSC
6.00 BSC
Dimensions (mm)
Symbols
MIN
NOM
MAX
NOTE
A
1.20
A2
0.91 REF
0.20
aaa
bbb
ccc
0.08
0.15
Tolerances of Form and Position
ddd
0.08
6
REF:
JEDEC, MO-195, VARIATION AD



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