AD7707 datasheet(6/40 Pages) AD

6 / 40 page

REV. A

AD7707

–6–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7707 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

DGND to AGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

AIN1, AIN2 Input Voltage to

LOCOM . . . . . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V

AIN3 Input Voltage to HICOM . . . . . . . . . . . –11 V to +30 V

VBIAS to AGND . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V

HICOM, LOCOM to AGND . . . . . . –0.3 V to AVDD + 0.3 V

REF(+), REF(–) to AGND . . . . . . . . –0.3 V to AVDD + 0.3 V

Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V

Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . . 75

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 139

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 kV

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

VDD

Temperature

Package

Model

Supply

Range

Description

Options

AD7707BR

2.7 V to 5.25 V

–40

°C to +85°C

SOIC

R-20

AD7707BRU

2.7 V to 5.25 V

–40

°C to +85°C

TSSOP

RU-20

EVAL-AD7707EB

Evaluation Board

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