HEATEVM datasheet(3/79 Pages) TI1

3 / 79 page

SM470R1B1M-HT

www.ti.com

SPNS155H – SEPTEMBER 2009 – REVISED SEPTEMBER 2013

ORDERING INFORMATION(1)

PACKAGE(2)

ORDERABLE PART NUMBER

TOP-SIDE MARKING

KGD

SM470R1B1MKGDS1

–55°C to 220°C

CQFP-HFQ

SM470R1B1MHFQS

CQFP-HKP

SM470R1B1MHKPS

–55°C to 150°C

LQFP-PGE

SM470R1B1MPGES

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

DIE LAYOUT

Table 1. Bare Die Information

DIE PAD

DIE

DIE PAD

BACKSIDE

DIE SIZE

DIE PAD SIZE

COORDINATES(1)

THICKNESS

COMPOSITION

FINISH

POTENTIAL

208.858 x 211.890 mils/

Silicon with

65.1 x 65.1(µm)

See Table 2

11 mils

AlCu

Ground

5304.99 x 5382.01 µm

backgrind

(1)

Pads 12, 22, 26, 136, 143, 146, 149 and 152 are test pads, no connections required. It is highly recommended to leave them open.

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