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80960CF-30 Datasheet(PDF) 19 Page - Intel Corporation |
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80960CF-30 Datasheet(HTML) 19 Page - Intel Corporation |
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19 / 62 page ![]() SPECIAL ENVIRONMENT 80960CF-30 -25 -16 Table 7 Ceramic PGA Package Dimension Symbols Letter or Description of Dimensions Symbol A Distance from seating plane to highest point of body A1 Distance between seating plane and base plane (lid) A2 Distance from base plane to highest point of body A3 Distance from seating plane to bottom of body B Diameter of terminal lead pin D Largest overall package dimension of length D1 A body length dimension outer lead center to outer lead center e1 Linear spacing between true lead position centerlines L Distance from seating plane to end of lead S1 Other body dimension outer lead center to edge of body NOTES 1 Controlling dimension millimeter 2 Dimension ‘‘e1’’ (‘‘e’’) is non-cumulative 3 Seating plane (standoff) is defined by PC board hole size 00415 – 00430 inch 4 Dimensions ‘‘B’’ ‘‘B1’’ and ‘‘C’’ are nominal 5 Details of Pin 1 identifier are optional 19 |
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