80960CF-30 datasheet(22/62 Pages) INTEL

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SPECIAL ENVIRONMENT 80960CF-30 -25 -16

ELECTRICAL SPECIFICATIONS

41 Absolute Maximum Ratings

Parameter

Maximum Rating

Storage Temperature

65 Cto a150 C

Case Temperature Under Bias(2)

40 Cto a125 C

Supply Voltage wrt VSS

05V to a65V

Voltage on Other pins wrt VSS

05V to VCC a05V

NOTICE This data sheet contains information on

products in the sampling and initial production phases

of development It is valid for the devices indicated in

the revision history The specifications are subject to

change without notice

WARNING Stressing the device beyond the ‘‘Absolute

Maximum Ratings’’ may cause permanent damage

These are stress ratings only Operation beyond the

‘‘Operating Conditions’’ is not recommended and ex-

tended exposure beyond the ‘‘Operating Conditions’’

may affect device reliability

Operating Conditions

Operating Conditions (80960CF-33 -25 -16)

Symbol

Parameter

Min

Max

Units

Notes

VCC

Supply Voltage

80960CF-30

475

525

80960CF-25

450

550

80960CF-16

450

550

fCLK2x

Input Clock Frequency (2-x Mode)

80960CF-30

606

MHz

80960CF-25

MHz

80960CF-16

MHz

fCLK1x

Input Clock Frequency (1-x Mode)

80960CF-30

303

MHz

80960CF-25

MHz

(1)

80960CF-16

MHz

Case Temperature Under Bias

PGA Package

110

80960CF-30 -25 -16

NOTES

(1) When in the 1-x input clock mode CLKIN is an input to an internal phase-locked loop and must maintain a minimum

frequency of 8 MHz for proper processor operation However in the 1-x Mode CLKIN may still be stopped when the

processor either is in a reset condition or is reset If CLKIN is stopped the specified RESET low time must be provided once

CLKIN restarts and has stabilized

(2) Case temperatures are ‘‘Instant On’’

43 Recommended Connections

Power and ground connections must be made to

multiple VCC and VSS (GND) pins Every 80960CF-

based circuit board should include power (VCC) and

ground (VSS) planes for power distribution Every

VCC pin must be connected to the power plane and

every VSS pin must be connected to the ground

plane Pins identified as ‘‘NC’’ must not be con-

nected in the system

Liberal decoupling capacitance should be placed

near the 80960CF The processor can cause tran-

sient power surges when its numerous output buff-

ers transition particularly when connected to large

capacitive loads

Low inductance capacitors and interconnects are

recommended for best high frequency electrical per-

formance Inductance can be reduced by shortening

board traces between the processor and decoupling

capacitors as much as possible Capacitors specifi-

cally designed for PGA packages will offer the low-

est possible inductance

For reliable operation always connect unused in-

puts to an appropriate signal level In particular any

unused interrupt (XINT NMI) or DMA (DREQ) input

should be connected to VCC through a pull-up resis-

tor as should BTERM if not used Pull-up resistors

should be in the range of 20 KX for each pin tied

high If READY or HOLD are not used the unused

input should be connected to ground NC pins

must always remain unconnected

Refer to the

i960 CA Microprocessor Reference Manual for more

information

80960CF-30 Datasheet(PDF) 22 Page - Intel Corporation

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