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RF69 Datasheet(PDF) 4 Page - List of Unclassifed Manufacturers |
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RF69 Datasheet(HTML) 4 Page - List of Unclassifed Manufacturers |
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4 / 81 page ![]() RF69 Page 4 Tel: +86-755-82973805 Fax: +86-755-82973550 E-mail: sales@hoperf.com http://www.hoperf.com 5.4.3. Rx Processing .......................................................................................................................................... 50 5.5. Packet Mode .................................................................................................................................................. 50 5.5.1. General Description................................................................................................................................... 50 5.5.2. Packet Format .......................................................................................................................................... 51 5.5.3. Tx Processing (without AES).................................................................................................................... 53 5.5.4. Rx Processing (without AES) ................................................................................................................... 54 5.5.5. AES ........................................................................................................................................................... 54 5.5.6. Handling Large Packets ........................................................................................................................... 56 5.5.7. Packet Filtering.......................................................................................................................................... 56 5.5.8. DC-Free Data Mechanisms ...................................................................................................................... 58 6. Configuration and Status Registers ...................................................................................................................... 60 6.1. General Description ...................................................................................................................................... 60 6.2. Common Configuration Registers ................................................................................................................. 63 6.3. Transmitter Registers ..................................................................................................................................... 66 6.4. Receiver Registers......................................................................................................................................... 67 6.5. IRQ and Pin Mapping Registers.................................................................................................................... 69 6.6. Packet Engine Registers ............................................................................................................................... 71 6.7. Temperature Sensor Registers ..................................................................................................................... 74 6.8. Test Registers ............................................................................................................................................... 74 7. Application Information ......................................................................................................................................... 75 7.1. Crystal Resonator Specification .................................................................................................................... 75 7.2. Reset of the Chip .......................................................................................................................................... 75 7.2.1. POR.......................................................................................................................................................... .. 75 7.2.2. Manual Reset .............................................................................................................................................. 76 7.3. Reference Design ......................................................................................................................................... 76 8. Packaging Information .......................................................................................................................................... 79 8.1. Package Outline Drawing.............................................................................................................................. 79 8.2. Thermal Impedance....................................................................................................................................... 79 |
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