LM3673 datasheet(4/28 Pages) TI

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LM3673

SNVS434L – JULY 2006 – REVISED OCTOBER 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN pin: voltage to GND

–0.2

FB, SW, EN pins

GND

−0.2

(VIN + 0.2

Continuous power dissipation(3)

Internally Limited

Junction temperature, TJ-MAX

125

°C

Maximum lead temperature

(soldering, 10 sec.)

260

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typical) and

disengages at TJ= 130°C (typical).

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

Input voltage(3)

2.7

5.5

Recommended load current

350

Junction temperature, TJ

–30

125

°C

Ambient temperature, TA

(4)

–30

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

The input voltage range recommended for ideal applications performance for the specified output voltages are as follows: VIN = 2.7 V to

4.5 V for 1.1 V

≤ VOUT < 1.5 V; VIN = 2.7 V to 5.5 V for 1.5 V ≤ VOUT < 1.8 V; VIN = (VOUT + VDROPOUT) to 5.5 V for 1.8 V ≤ VOUT ≤ 3.3 V

where VDROPOUT = ILOAD × (RDSON, PFET + RINDUCTOR)

(4)

In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the

maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package

(RθJA) in the application, as given by the following equation:TA-MAX = TJ-MAX− (RθJA × PD-MAX).

7.4 Thermal Information

LM3673

THERMAL METRIC(1)

YZR (DSBGA)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance(2)

181.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.9

°C/W

RθJB

Junction-to-board thermal resistance

110.3

°C/W

ψJT

Junction-to-top characterization parameter

7.4

°C/W

ψJB

Junction-to-board characterization parameter

110.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Junction-to-ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation

exists, special care must be given to thermal dissipation issues in board design.

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