WM8993 datasheet(228/229 Pages) WOLFSON

228 / 229 page

WM8993

Production Data

PD, November 2010, Rev 4.0

228

PACKAGE DIMENSIONS

DM060.B

B: 48 BALL W-CSP PACKAGE 3.64 X 3.54 X 0.7mm BODY, 0.50 mm BALL PITCH

CORNER

TOP VIEW

0.10

2 X

DETAIL 2

0.10

2 X

bbb

SOLDER BALL

DETAIL 1

BOTTOM VIEW

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.

3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.

0.219

3.00 BSC

3.54 BSC

0.3 BSC

3.00 BSC

0.50 BSC

3.64 BSC

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.7

0.361

0.386

0.411

0.785

0.615

0.244

0.269

0.070

0.035

0.105

0.314 BSC

0.25 BSC

WM8993 Datasheet(PDF) 228 Page - Wolfson Microelectronics plc

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