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SC2200 Datasheet(PDF) 364 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # SC2200
Description  Thin Client On a Chip
PDF  433 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

SC2200 Datasheet(HTML) 364 Page - National Semiconductor (TI)

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364
Revision 3.0
Electrical Specifications (Continued)
8.2
DC CHARACTERISTICS
Table 8-9 describes the signal buffer types of the SC2200.
(See Table 2-2 "432-EBGA Ball Assignment - Sorted by
Ball Number" on page 22 and Table 2-4 "481-TEPBGA Ball
Assignment - Sorted by Ball Number" on page 37) for each
signal’s buffer type.)
The subsections that follows provide detailed DC charac-
teristics according to buffer type.
Table 8-9. Buffer Types
Symbol
Description
Reference
Diode
Diodes only, no buffer
---
INAB
Input, ACCESS.bus compatible with Schmitt Trigger
Section 8.2.1
INBTN
Input, TTL compatible with Schmitt Trigger, low leakage
Section 8.2.2
INPCI
Input, PCI compatible
Section 8.2.3
INSTRP
Input, Strap ball (min VIH is 0.6VIO) with weak pull-down
Section 8.2.4
INT
Input, TTL compatible
Section 8.2.5
INTS
Input, TTL compatible with Schmitt Trigger type 200 mV
Section 8.2.6
INTS1
Input, with Schmitt Trigger type 200 mV
Section 8.2.7
INUSB
Input, USB compatible
Section 8.2.8
OAC97
Output, Totem-Pole, AC97 compatible
Section 8.2.9
ODn
Output, Open-Drain, capable of sinking
n mA.1
Section 8.2.10
ODPCI
Output, Open-Drain, PCI compatible
Section 8.2.11
Op/n
Output, Totem-Pole, capable of sourcing
p mA and sinking n mA
Section 8.2.12
OPCI
Output, PCI compatible, TRI-STATE
Section 8.2.13
OUSB
Output, USB compatible
Section 8.2.14
TSp/n
Output, TRI-STATE, capable of sourcing
p mA and sinking n mA
Section 8.2.15
WIRE
Wire, no buffer
---
1.
Output from these signals is open-drain and cannot be forced high.



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