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AD9689 Datasheet(PDF) 12 Page - Analog Devices |
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AD9689 Datasheet(HTML) 12 Page - Analog Devices |
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12 / 134 page ![]() AD9689 Data Sheet Rev. A | Page 12 of 134 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Electrical AVDD1 to AGND 1.05 V AVDD1_SR to AGND 1.05 V AVDD2 to AGND 2.0 V AVDD3 to AGND 2.70 V DVDD to DGND 1.05 V DRVDD1 to DRGND 1.05 V DRVDD2 to DRGND 2.0 V SPIVDD to DGND 2.0 V AGND to DRGND −0.3 V to +0.3 V AGND to DGND −0.3 V to +0.3 V DGND to DRGND −0.3 V to +0.3 V VIN±x to AGND AGND − 0.3 V to AVDD3 + 0.3 V CLK± to AGND AGND − 0.3 V to AVDD1 + 0.3 V SCLK, SDIO, CSB to DGND DGND − 0.3 V to SPIVDD + 0.3 V PDWN/STBY to DGND DGND − 0.3 V to SPIVDD + 0.3 V SYSREF± to AGND 2.5 V SYNCINB± to DRGND 2.5 V Junction Temperature Range (TJ) −40°C to +125°C Storage Temperature Range, Ambient (TA) −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required. θJA is the natural convection junction-to-ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 7. Thermal Resistance Package Type θJA θJC_TOP ΨJB Unit BP-196-41 16.26 1.4 5.44 °C/W 1 Test Condition 1: Thermal impedance simulated values are based on JEDEC 2S2P thermal test board with 190 thermal vias. See JEDEC JESD51. ESD CAUTION |
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