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AD9689 Datasheet(PDF) 12 Page - Analog Devices

Part # AD9689
Description  Dual Analog-to-Digital Converter
PDF  134 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD9689 Datasheet(HTML) 12 Page - Analog Devices

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AD9689
Data Sheet
Rev. A | Page 12 of 134
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD1 to AGND
1.05 V
AVDD1_SR to AGND
1.05 V
AVDD2 to AGND
2.0 V
AVDD3 to AGND
2.70 V
DVDD to DGND
1.05 V
DRVDD1 to DRGND
1.05 V
DRVDD2 to DRGND
2.0 V
SPIVDD to DGND
2.0 V
AGND to DRGND
−0.3 V to +0.3 V
AGND to DGND
−0.3 V to +0.3 V
DGND to DRGND
−0.3 V to +0.3 V
VIN±x to AGND
AGND − 0.3 V to AVDD3 + 0.3 V
CLK± to AGND
AGND − 0.3 V to AVDD1 + 0.3 V
SCLK, SDIO, CSB to DGND
DGND − 0.3 V to SPIVDD + 0.3 V
PDWN/STBY to DGND
DGND − 0.3 V to SPIVDD + 0.3 V
SYSREF± to AGND
2.5 V
SYNCINB± to DRGND
2.5 V
Junction Temperature Range (TJ)
−40°C to +125°C
Storage Temperature Range,
Ambient (TA)
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required. θJA is the natural convection
junction-to-ambient thermal resistance measured in a one cubic
foot sealed enclosure. θJC is the junction to case thermal resistance.
Table 7. Thermal Resistance
Package Type
θJA
θJC_TOP
ΨJB
Unit
BP-196-41
16.26
1.4
5.44
°C/W
1
Test Condition 1: Thermal impedance simulated values are based on
JEDEC 2S2P thermal test board with 190 thermal vias. See JEDEC JESD51.
ESD CAUTION



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