LTC3129 datasheet(4/30 Pages) LINER

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LTC3129

3129fc

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elecTrical characTerisTics

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC3129 is tested under pulsed load conditions such that

TJ ≈ TA. The LTC3129E is guaranteed to meet specifications from

0°C to 85°C junction temperature. Specifications over the –40°C to

125°C operating junction temperature range are assured by design,

characterization and correlation with statistical process controls. The

LTC3129I is guaranteed over the full –40°C to 125°C operating junction

temperature range. The junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) according to the

formula: TJ = TA + (PD • θJA°C/W), where θJA is the package thermal

impedance. Note that the maximum ambient temperature consistent

with these specifications, is determined by specific operating conditions

in conjunction with board layout, the rated thermal package thermal

resistance and other environmental factors.

Note 3: Specification is guaranteed by design and not 100% tested in

production.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

VOUT UV Hysteresis

150

VOUT Current – Shutdown

RUN = 0V, VOUT = 15V Including Switch Leakage

100

VOUT Current – Sleep

PWM = 0V, FB = 1.25V

VOUT Current – Active

PWM = VCC, VOUT = 15V (Note 4), FB = 1.25V

µA

PGOOD Threshold, Falling

Referenced to Programmed VOUT Voltage

–5.5

–7.5

–10

PGOOD Hysteresis

Referenced to Programmed VOUT Voltage

2.5

PGOOD Voltage Low

ISINK = 1mA

250

300

PGOOD Leakage

PGOOD = 15V

The l denotes the specifications which apply over the specified operating

junction temperature range, otherwise specifications are at TA = 25°C (Note 2). Unless otherwise noted, VIN = 12V, VOUT = 5V.

Note 4: Current measurements are made when the output is not switching.

Note 5: This IC includes overtemperature protection that is intended

to protect the device during momentary overload conditions. Junction

temperature will exceed 125°C when overtemperature protection is active.

Continuous operation above the specified maximum operating junction

temperature may result in device degradation or failure.

Note 6: Failure to solder the exposed backside of the package to the PC

board ground plane will result in a much higher thermal resistance.

Note 7: Switch timing measurements are made in an open-loop test

configuration. Timing in the application may vary somewhat from these

values due to differences in the switch pin voltage during non-overlap

durations when switch pin voltage is influenced by the magnitude and

duration of the inductor current.

Note 8: Voltage transients on the switch pin(s) beyond the DC limits

specified in the Absolute Maximum Ratings are non-disruptive to normal

operation when using good layout practices as described elsewhere in the

data sheet and application notes and as seen on the product demo board.

Efficiency, VOUT = 2.5V

Efficiency, VOUT = 3.3V

Typical perForMance characTerisTics T

A = 25°C, unless otherwise noted.

Power Loss, VOUT = 2.5V

OUTPUT CURRENT (mA)

0.01

100

0.1

3129 G01

1000

100

VIN = 2.5V

VIN = 3.6V

VIN = 5V

VIN = 10V

VIN = 15V

BURST

PWM

OUTPUT CURRENT (mA)

0.01

100

0.1

3129 G03

1000

100

VIN = 2.5V

VIN = 3.6V

VIN = 5V

VIN = 10V

VIN = 15V

PWM

BURST

OUTPUT CURRENT (mA)

0.01

1000

100

0.1

0.01

0.1

3129 G02

1000

100

VIN = 2.5V

VIN = 3.6V

VIN = 5V

VIN = 10V

VIN = 15V

BURST

PWM

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