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SI5321 Datasheet(PDF) 31 Page - List of Unclassifed Manufacturers |
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SI5321 Datasheet(HTML) 31 Page - List of Unclassifed Manufacturers |
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31 / 34 page ![]() Si5321 Rev. 2.3 31 5. Package Outline Figure 12 illustrates the package details for the Si5321. Table 11 lists the values for the dimensions shown in the illustration. Figure 12. 63-Ball Ceramic Ball Grid Array (CBGA) Table 11. Package Drawing Dimensions Dimension Description Minimum Nominal Maximum A Total Package Height 2.13 2.28 2.43 A1 Standoff 0.60 0.70 0.80 A2 Ceramic Thickness 0.88 0.98 1.08 A3 Mold Cap Thickness 0.55 0.60 0.65 b Solder Ball Diameter 0.65 0.70 0.75 D Ceramic Body Size 8.85 9.00 9.15 D1 Mold Cap Size 8.55 8.75 8.95 e Solder Ball Pitch 1.00 BSC S Pitch to Centerline 0.50 BSC |
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