Si5321 datasheet(32/34 Pages) ETC

32 / 34 page

Si5321

Rev. 2.3

6. 9x9 mm CBGA Card Layout

Table 12. Recommended Land Pattern Dimensions

Symbol

Parameter

Dimension

Notes

Min

Nom

Max

Column Width

—

7.00 REF

—

Row Height

—

7.00 REF

—

Pad Pitch

—

1.00 BSC

—

Placement Courtyard

10.00

—

Pad Diameter

0.64

0.68

0.72

2, 3

Notes:

The Placement Courtyard is the minimum keep-out area required to assure assembly clearances.

Pad Diameter is Copper Defined (Non-Solder Mask Defined/NSMD).

OSP Surface Finish Recommended.

Controlling dimension is millimeters.

Land Pad Dimensions comply with IPC-SM-782 guidelines.

Target solder paste volume per pad is 0.065 mm3 ± 0.010 mm3 (4000 mils3 ± 600 mils3).

Recommended stencil aperture dimensions to achieve target solder paste volume are 0.191 mm

thick x 0.68±0.01 mm diameter, with a 0.025 mm taper.

Recommended stencil type is chemically etched stainless steel with circularly tapered apertures.

Placement Courtyard

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