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A29DL323 Datasheet(PDF) 46 Page - AMIC Technology

Part # A29DL323
Description  32 Megabit (4M x 8-Bit/2M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory
PDF  50 Pages
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Manufacturer  AMICC [AMIC Technology]
Direct Link  http://www.amictechnology.com
Logo AMICC - AMIC Technology

A29DL323 Datasheet(HTML) 46 Page - AMIC Technology

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A29DL32x Series
PRELIMINARY
(May, 2005, Version 0.0)
45
AMIC Technology, Corp.
ERASE AND PROGRAMMING PERFORMANCE
Parameter
Typ. (Note 1)
Max. (Note 2)
Unit
Comments
Sector Erase Time
0.7
15
sec
Chip Erase Time
27
sec
Excludes 00h programming
prior to erasure (Note 4)
Byte Programming Time
5
150
µs
Word Programming Time
7
210
µs
Accelerated Word/Byte Programming Time
4
120
µs
Byte Mode
9
27
sec
Chip Programming Time
(Note 3)
Word Mode
6
18
sec
Excludes system-level
overhead (Note 5)
Notes:
1. Typical program and erase times assume the following conditions: 25
°C, 3.0V VCC, 10,000 cycles. Additionally, programming
typically assumes checkerboard pattern.
2. Under worst case conditions of 90
°C, VCC = 2.7V, 100,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum byte program time listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See Table 12
for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 10,000 cycles.
LATCH-UP CHARACTERISTICS
Description
Min.
Max.
Input Voltage with respect to VSS on all I/O pins
-1.0V
VCC+1.0V
VCC Current
-100 mA
+100 mA
Input voltage with respect to VSS on all pins except I/O pins
(including A9,
OE and
RESET )
-1.0V
12.5V
Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at time.
PACKAGE AND PIN CAPACITANCE
Parameter Symbol
Parameter Description
Test Setup
Typ.
Max.
Unit
TSOP
6
7.5
pF
CIN
Input Capacitance
VIN=0
TF BGA
4.2
5
pF
TSOP
8.5
12
pF
COUT
Output Capacitance
VOUT=0
TF BGA
5.4
6.5
pF
TSOP
7.5
9
pF
CIN2
Control Pin Capacitance
VIN=0
TF BGA
3.9
4.7
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25
°C, f = 1.0MHz
DATA RETENTION
Parameter
Test Conditions
Min
Unit
150
°C
10
Years
Minimum Pattern Data Retention Time
125
°C
20
Years



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