THS4513 datasheet(29/34 Pages) TI

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Layout Recommendations

0.144

0.0195

0.144

0.010

vias

Pin 1

Top View

0.012

0.030

0.0705

0.015

0.0095

0.049

0.032

0.0245

THS4513

SLOS472 – AUGUST 2005

8. A single-point connection to ground on L2 is

recommended for the input termination resistors

It is recommended to follow the layout of the external

R1 and R2. This should be applied to the input

components near the amplifier, ground plane con-

gain resistors if termination is not used.

struction, and power routing of the EVM as closely as

9. The THS4513 recommended PCB footprint is

possible. General guidelines are:

shown in Figure 87.

1. Signal routing should be direct and as short as

possible into and out of the opamp circuit.

2. The feedback path should be short and direct

avoiding vias.

3. Ground or power planes should be removed from

directly under the amplifier’s input and output

pins.

4. An output resistor is recommended on each

output, as near to the output pin as possible.

5. Two 10-µF and two 0.1-µF power-supply decoup-

ling capacitors should be placed as near to the

power-supply pins as possible.

6. Two 0.1-µF capacitors should be placed between

the CM input pins and ground. This limits noise

coupled into the pins. One each should be placed

to ground near pin 4 and pin 9.

7. It is recommended to split the ground pane on

layer 2 (L2) as shown below and to use a solid

ground on layer 3 (L3). A single-point connection

Figure 87. QFN Etch and Via Pattern

should be used between each split section on L2

and L3.

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