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APPLICATION INFORMATION

TRF1121

TRF1221

SLWS170A – APRIL 2005 – REVISED DECEMBER 2005

A typical application schematic is shown in Figure 23, while a mechanical drawing of the package outline (LPCC

Quad 7 mm

× 7 mm, 48 pin) is presented in Figure 24.

The recommended PCB layout mask is shown in Figure 25. PCB material recommendations are shown in ,

Table 1and Figure 22.

Table 1. PCB Recommendations

Board material

FR4

Board material core thickness

10 mil

Copper thickness (starting)

1 oz

Prepreg thickness

8 mil

Recommended number of layers

4

Via plating thickness

0.5 oz

Final plate

White immersion tin

Final board thickness

33–37 mil

Figure 22. PCB Construction and Via Cross Section

21