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PCA9306DC1/DG Datasheet(PDF) 24 Page - NXP Semiconductors |
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PCA9306DC1/DG Datasheet(HTML) 24 Page - NXP Semiconductors |
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24 / 38 page ![]() NXP Semiconductors PCA9306 Dual bidirectional I2C-bus and SMBus voltage-level translator 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature MSL: Moisture Sensitivity Level Figure 20. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14 Soldering: PCB footprints sot096-1_fr occupied area solder lands Dimensions in mm placement accuracy ± 0.25 1.30 0.60 (8×) 1.27 (6×) 4.00 6.60 5.50 7.00 Figure 21. PCB footprint for SOT96-1 (SO8); reflow soldering PCA9306 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. Product data sheet Rev. 9.3 — 14 November 2022 24 / 38 |
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