PCA9306DC1SLASHDG datasheet(37/38 Pages) NXP

37 / 38 page

NXP Semiconductors

PCA9306

Dual bidirectional I2C-bus and SMBus voltage-level translator

Tables

Tab. 1.

Ordering information ..........................................3

Tab. 2.

Ordering options ................................................3

Tab. 3.

Pin description ...................................................5

Tab. 4.

Function selection (example) ............................ 6

Tab. 5.

Limiting values .................................................. 6

Tab. 6.

Operating conditions ......................................... 6

Tab. 7.

Static characteristics ......................................... 7

Tab. 8.

Dynamic characteristics (translating down) ....... 7

Tab. 9.

Dynamic characteristics (translating up) ............8

Tab. 10. Application operating conditions ......................10

Tab. 11. Pull-up resistor minimum values, 3 mA

driver sink current for PCA9306 and

NVT20xx ..........................................................11

Tab. 12. Pull-up resistor minimum values, 10 mA

driver sink current for PCA9306 and

NVT20xx ..........................................................11

Tab. 13. Pull-up resistor minimum values, 15 mA

driver sink current for PCA9306 and

NVT20xx ..........................................................11

Tab. 14. SnPb eutectic process (from J-STD-020D) ..... 23

Tab. 15. Lead-free process (from J-STD-020D) ............23

Tab. 16. Abbreviations ...................................................35

Tab. 17. Revision history ...............................................35

Figures

Fig. 1.

Logic diagram of PCA9306 (positive logic) ........4

Fig. 2.

Pin configuration for TSSOP8 (DP1) .................4

Fig. 3.

Pin configuration for TSSOP8 (DP)

(MSOP8) ............................................................4

Fig. 4.

Pin configuration for VSSOP8 (DC1; DC1/

DG) ....................................................................5

Fig. 5.

Pin configuration for SO8 ..................................5

Fig. 6.

Pin configuration for XQFN8 ............................. 5

Fig. 7.

Pin configuration for XSON8 and X2SON8

(GF; JK) ............................................................ 5

Fig. 8.

Load circuit for outputs ..................................... 8

Fig. 9.

Typical application circuit (switch always

enabled) .............................................................9

Fig. 10.

Typical application circuit (switch enable

control) ...............................................................9

Fig. 11.

An example waveform for maximum

frequency .........................................................12

Fig. 12.

Package outline SOT96-1 (SO8) .....................14

Fig. 13.

Package outline SOT505-1 (TSSOP8) ............15

Fig. 14.

Package outline SOT505-2 (TSSOP8) ............16

Fig. 15.

Package outline SOT765-1 (VSSOP8) ............17

Fig. 16.

Package outline SOT902-2 (XQFN8) ..............18

Fig. 17.

Package outline SOT1089 (XSON8) ...............19

Fig. 18.

Package outline SOT996-2 (XSON8U) ........... 20

Fig. 19.

Package outline SOT2015-1 (X2SON8) ..........21

Fig. 20.

Temperature profiles for large and small

components .....................................................24

Fig. 21.

PCB footprint for SOT96-1 (SO8); reflow

soldering ..........................................................24

Fig. 22.

PCB footprint for SOT96-1 (SO8); wave

soldering ..........................................................25

Fig. 23.

PCB footprint for SOT505-1 (TSSOP8);

reflow soldering ............................................... 25

Fig. 24.

PCB footprint for SOT505-2 (TSSOP8);

reflow soldering ............................................... 26

Fig. 25.

PCB footprint for SOT765-1 (VSSOP8);

reflow soldering ............................................... 27

Fig. 26.

PCB footprint for SOT1089 (XSON8);

reflow soldering ............................................... 28

Fig. 27.

PCB footprint for SOT996-2 (XSON8U);

reflow soldering ............................................... 29

Fig. 28.

PCB footprint for SOT902-2 (XQFN8);

reflow soldering ............................................... 30

Fig. 29.

PCB footprint for SOT2015-1 (X2SON8);

reflow soldering (1 of 3) .................................. 31

Fig. 30.

PCB footprint for SOT2015-1 (X2SON8);

reflow soldering (2 of 3) .................................. 32

Fig. 31.

PCB footprint for SOT2015-1 (X2SON8);

reflow soldering (3 of 3) .................................. 33

Fig. 32.

PCB footprint for SOT2015-1 (X2SON8);

notes ................................................................34

PCA9306

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 9.3 — 14 November 2022

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