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PCA9306DC1/DG Datasheet(PDF) 25 Page - NXP Semiconductors |
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PCA9306DC1/DG Datasheet(HTML) 25 Page - NXP Semiconductors |
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25 / 38 page  NXP Semiconductors PCA9306 Dual bidirectional I2C-bus and SMBus voltage-level translator sot096-1_fw solder resist occupied area solder lands Dimensions in mm board direction placement accurracy ± 0.25 4.00 5.50 1.30 0.3 (2×) 0.60 (6×) 1.20 (2×) 1.27 (6×) 7.00 6.60 enlarged solder land Figure 22. PCB footprint for SOT96-1 (SO8); wave soldering sot505-1_fr occupied area solder lands Dimensions in mm 3.200 3.600 5.750 0.725 0.650 0.125 0.450 0.600 3.600 2.950 0.125 1.150 5.500 Figure 23. PCB footprint for SOT505-1 (TSSOP8); reflow soldering PCA9306 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. Product data sheet Rev. 9.3 — 14 November 2022 25 / 38 |
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