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PCA9306DC1/DG Datasheet(PDF) 27 Page - NXP Semiconductors |
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PCA9306DC1/DG Datasheet(HTML) 27 Page - NXP Semiconductors |
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27 / 38 page ![]() NXP Semiconductors PCA9306 Dual bidirectional I2C-bus and SMBus voltage-level translator DIMENSIONS in mm Ay By D1 D2 Gy Hy P1 3.500 2.000 0.750 0.300 C 0.400 2.250 1.750 Gx 3.750 sot765-1_fr Hx 3.075 0.500 SOT765-1 Footprint information for reflow soldering of VSSOP8 package Ay By Gy C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D1 D2 (4x) P2 0.550 solder land occupied area (0.175) Figure 25. PCB footprint for SOT765-1 (VSSOP8); reflow soldering PCA9306 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. Product data sheet Rev. 9.3 — 14 November 2022 27 / 38 |
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