DSP56300FMSLASHAD datasheet(32/120 Pages) NXP

32 / 120 page

2-2

Absolute Maximum Ratings

2.3 Absolute Maximum Ratings

2.4 Thermal Characteristics

Table 2-1. Maximum Ratings

Rating1

Symbol

Value1, 2

Unit

Supply Voltage

VCC

–0.3 to +4.0

All input voltages excluding “5 V tolerant” inputs

VIN

GND – 0.3 to VCC + 0.3

All “5 V tolerant” input voltages3

VIN5

GND – 0.3 to VCC + 3.95

Current drain per pin excluding VCC and GND

Operating temperature range

–40 to +100

°C

Storage temperature

TSTG

–55 to +150

°C

Notes:

GND = 0 V, VCC = 3.3 V ± 0.3 V, TJ = –40°C to +100°C, CL = 50 pF

Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not

guaranteed. Stress beyond the maximum rating may affect device reliability or cause permanent

damage to the device.

CAUTION: All “5 V Tolerant” input voltages cannot be more than 3.95 V greater than the supply

voltage; this restriction applies to “power on,” as well as during normal operation. In any case, the

input voltages must not be higher than 5.75 V. “5 V Tolerant” inputs are inputs that tolerate 5 V.

Table 2-2. Thermal Characteristics

Characteristic

Symbol

PBGA3

Value

PBGA4

Value

Unit

Junction-to-ambient thermal resistance1

RθJA or θJA

48.4

25.2

°C/W

Junction-to-case thermal resistance

RθJC or θJC

—

°C/W

Thermal characterization parameter

—

°C/W

Notes:

Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided

printed circuit board per JEDEC Specification JESD51-3.

Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88,

with the exception that the cold plate temperature is used for the case temperature.

These are simulated values. See note 1 for test board conditions.

These are simulated values. The test board has two 2-ounce signal layers and two 1-ounce solid

ground planes internal to the test board.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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