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MP2733 Datasheet(PDF) 6 Page - MPS Industries, Inc.

Part # MP2733
Description  Wide Input Range, 4.5A,I2C-Controlled SW Charger with NVDC Power Path and USB OTG and Enhanced ADC
PDF  51 Pages
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Manufacturer  MPSIND [MPS Industries, Inc.]
Direct Link  http://www.mpsind.com/index.html
Logo MPSIND - MPS Industries, Inc.

MP2733 Datasheet(HTML) 6 Page - MPS Industries, Inc.

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MP2733
– 4.5A SW CHARGER WITH I2C CONTROL, NVDC POWER PATH, USB OTG
MP2733 Rev. 1.1
www.MonolithicPower.com
6
5/18/2023
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2023 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
IN, PMID to GND ..........................-0.3V to +22V
SW to GND ............-0.3V (-2V for 20ns) to +22V
BST to SW
…………...................SW to SW + 5V
BATT, SYS to GND………………. ..-0.3V to +6V
All other pins to GND ......................-0.3V to +5V
STAT, INT sink current ............................. 10mA
Continuous power dissipation (TA = 25°C) (2) ......
................................................................... 2.6W
Junction temperature
………………………150°C
Lead temperature (solder) ........................260°C
Storage temperature
………….. -65°C to +150°C
ESD Ratings
Human body model (HBM) .................... ±2000V
Charged device model (CDM) ................. ±750V
Recommended Operating Conditions (3)
VIN to GND ................................... 3.7V to 16V (4)
IIN......................................................Up to 3.25A
ISYS .....................................................Up to 4.5A
ICC.......................................................Up to 4.5A
VBATT.................................................Up to 4.67V
IDSCHG (CONTINUOUS).................................Up to 8.5A
IDSCHG (PULSE)............................................Up to 9A
Operating junction temp (TJ) .... -40°C to +125°C
Thermal Resistance (5)
θJA
θJC
QFN-26 (3.5mmx3.5mm)........ 48 ...... 11... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature, TJ (MAX), the junction-to-
ambient thermal resistance,
θ
JA, and the ambient temperature,
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX) - TA) / θJA. Exceeding the maximum allowable power
dissipation can cause excessive die temperature, and the
regulator may go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its operating
conditions.
4) The inherent switching noise voltage should not exceed the
absolute maximum rating on either the BST or SW pin. A tight
layout minimizes switching loss.
5) Measured on JESD51-7, 4-layer PCB.



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