LP5813 datasheet(5/60 Pages) TI

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage range

at terminals

VIN, SW, VOUT, VCC

–0.3

SW spike at 10 ns

–0.7

SW spike at 1 ns

–0.7

OUT0, OUT1, OUT2, OUT3

–0.3

EN, SCL, SDA, SYNC

–0.3

Junction temperature

–40

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±4000

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage range

0.5

5.5

VOUT

Output voltage setting range

5.5

Effective inductance range

0.37

2.9

μH

CIN

Effective input capacitance range

4.7

μF

COUT

Effective output capacitance range

1000

μF

Ambient temperature

–40

°C

Operating junction temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

LP5813

UNIT

YBH (DSBGA)

12 PINS

RθJA

Junction-to-ambient thermal resistance

92.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.4

°C/W

RθJB

Junction-to-board thermal resistance

25.9

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

25.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

LP5813

SNVSC74 – SEPTEMBER 2023

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