AD5940 datasheet(18/143 Pages) AD

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Data Sheet

AD5940/AD5941

ABSOLUTE MAXIMUM RATINGS

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Rev. D | 18 of 143

Table 5.

Parameter

Rating

AVDD to AGND

−0.3 V to +3.9 V

DVDD to DGND

−0.3 V to +3.9 V

IOVDD to DGND

−0.3 V to +3.9 V

Analog Input Voltage to AGND

−0.3 V to AVDD +0.3 V

Digital Input Voltage to DGND

−0.3 V to DVDD +0.3 V

Digital Output Voltage to DGND

−0.3 V to DVDD +0.3 V

AGND to DGND

−0.3 V to +0.3 V

Total GPIOx Pins Current

Positive

0 mA to 30 mA

Negative

−30 mA to 0 mA

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

AD5940/AD5941

−40°C to +85°C

AD5941W

−40°C to +105°C

Reflow Profile

Moisture Sensitivity Level 3 (MSL3)

J-STD 020E (JEDEC)

Junction Temperature

150°C

Electrostatic Discharge (ESD)

Human Body Model (HBM)

4 kV

Field Induced Charged Device Model

(FICDM)

750 V

Machine Model (MM)

100 V

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 6. Thermal Resistance

Package Type1

θJA

θJC

Unit

CB-56-3

33.0702

0.0642

°C/W

CP-48-4

32.03

2.85

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD51.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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