Electronic Components Datasheet Search
  English  ▼

X  

TDA4VM21 Datasheet(PDF) 299 Page - Texas Instruments

Part # TDA4VM21
Description  TDA4VM Processors
PDF  331 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TDA4VM21 Datasheet(HTML) 299 Page - Texas Instruments

Back Button TDA4VM21 Datasheet HTML 295Page - Texas Instruments TDA4VM21 Datasheet HTML 296Page - Texas Instruments TDA4VM21 Datasheet HTML 297Page - Texas Instruments TDA4VM21 Datasheet HTML 298Page - Texas Instruments TDA4VM21 Datasheet HTML 299Page - Texas Instruments TDA4VM21 Datasheet HTML 300Page - Texas Instruments TDA4VM21 Datasheet HTML 301Page - Texas Instruments TDA4VM21 Datasheet HTML 302Page - Texas Instruments TDA4VM21 Datasheet HTML 303Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 299 / 331 page
background image
Media Independent Interface (RGMII), Reduced Media Independent Interface (RMII), and the Management Data
Input/Output (MDIO) interface for physical layer device (PHY) management.
For more information, see Gigabit Ethernet Switch (CPSW0) section in Peripherals chapter in the device TRM.
7.4.5.5 CPSW9G
The 9-port Gigabit Ethernet Switch (CPSW0) subsystem provides Ethernet packet communication for the device
and can be configured as an Ethernet switch. CPSW0 features the Serial Gigabit Media Independent Interface
(SGMII), Reduced Gigabit Media Independent Interface (RGMII), Reduced Media Independent Interface (RMII)
and the Management Data Input/Output (MDIO) interface for physical layer device (PHY) management.
For more information, see Gigabit Ethernet Switch (MCU_CPSW0) section in Peripherals chapter in the device
TRM.
7.4.5.6 DCC
The Dual Clock Comparator (DCC) is used to determine the accuracy of a clock signal during the time
execution of an application. Specifically, the DCC is designed to detect drifts from the expected clock frequency.
The desired accuracy can be programed based on calculation for each application. The DCC measures the
frequency of a selectable clock source using another input clock as a reference.
For more information, see Dual Clock Comparator (DCC) section in Peripherals chapter in the device TRM.
7.4.5.7 DDRSS
The DDR subsystem in this device comprises DDR controller, DDR PHY and wrapper logic to integrate these
blocks in the device. The DDR subsystem is referred to as DDRSS0 and is used to provide an interface to
external SDRAM devices which can be utilized for storing program or data. DDRSS0 is accessed via MSMC,
and not directly through the system interconnect.
For more information, see DDR Subsystem (DDRSS) section in Peripherals chapter in the device TRM.
7.4.5.8 DSS
The DSS is a flexible composition-enabled display subsystem, that supports multiple high resolution display
outputs. It consists of one Display Controller (DISPC) and one Frame Buffer Decompression Core (FBDC).
The DISPC supports a multi-layer blending and transparency for each of its display outputs. The DISPC also
supports a write-back pipeline with scaling to enable memory-to-memory composition and/or to capture a display
output for Ethernet video encoding.
For more information, see Display Subsystem (DSS) section in Peripherals chapter in the device TRM.
7.4.5.8.1 DSI
The MIPI DSI v1.3.1 Controller (DSITX) implements the stream arbitration and low-level protocol layer
functionalities required by MIPI DSI 1.3 standard. It supports up to 4 x 2.5 Gbps D-PHY data lanes in a single-
link configuration and handles the byte lane mapping per use case (1, 2, 3, or 4-lanes). The accompaning DSI
(Physical Layer) D-PHY module (DPHYTX) provides the video output interfacing by implementing a four-lane
MIPI D-PHY transmitter.
For more information, see Display Subsystem (DSS) and Display Peripherals section in Peripherals chapter in
the device TRM.
7.4.5.8.2 eDP
The VESA DP1.4/eDP1.4 Compliant Transmitter Host Controller (EDP) can output up to 4 video streams
(through Multiple Stream Transport / MST) and one audio stream through the 4-lane accompaning SerDes
module. It provides up to 25.92 Gbps of application bandwidth. An additional eDP (Physical Layer) auxiliary PHY
(AUXPHY) module implements a doubly-terminated differential pair required for 1 Mbps data rates over a long
(15m) cable.
www.ti.com
TDA4VM-Q1, TDA4VM
SPRSP36K – SEPTEMBER 2021 – REVISED APRIL 2024
Copyright © 2024 Texas Instruments Incorporated
Submit Document Feedback
299
Product Folder Links: TDA4VM-Q1 TDA4VM



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com