TMS320DM355 datasheet(156/158 Pages) TI

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Mechanical Data

8.1 Thermal Data for ZCE

8.1.1 Packaging Information

TMS320DM355

Digital Media System-on-Chip (DMSoC)

SPRS463B – SEPTEMBER 2007 – REVISED OCTOBER 2007

The following table(s) show the thermal resistance characteristics for the PBGA – ZCE mechanical

package.

Note

that

micro-vias

are

not

required.

Contact

your

representative

for

routing

recommendations.

The following table shows the thermal resistance characteristics for the PBGA – ZCE mechanical

package.

Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]

NO.

µC/W

AIR FLOW (m/s)(1)

ΘJC

Junction-to-case

TBD

ΘJB

Junction-to-board

TBD

ΘJA

Junction-to-free air

TBD

PsiJT

Junction-to-package top

TBD

PsiJB

Junction-to-board

TBD

(1)

m/s = meters per second

The following packaging information and reflect the most current data available for the designated device.

This data is subject to change without notice and without revision of this document. Note that micro-vias

are not required for this package.

Mechanical Data

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