TMPR4956C datasheet(41/286 Pages) TOSHIBA

41 / 286 page

Handling Precautions

3.6.3

Corrosive Gases

Devices react to corrosive gases may cause deteriorating device characteristics. For example, consideration must

be given to lead corrosion and leakage between leads caused by the chemical reaction that occurs when a device

is placed near a rubber product. The reason is that the rubber product will not only produce condensation but

also generate sulfur-bearing corrosive gases under high-humidity conditions.

3.6.4

Radioactive and Cosmic Rays

Standard devices are not designed with protection against radioactive and cosmic rays. Devices must therefore

be shielded if the device will be used in environments that may result in exposure to radioactive or cosmic rays

above the levels that exist in the natural environment.

3.6.5

Strong Electrical and Magnetic Fields

Devices exposed to magnetic fields can undergo a polarization phenomenon in the plastic material or within the

IC chip, which gives rise to abnormal conditions such as impedance changes or leak current increases.

Malfunctions have been reported in LSIs mounted near television deflection yokes. In such cases, the device

installation location must be changed or the device must be shielded against the electrical or magnetic field.

Shielding against magnetism is especially required in an alternating magnetic field due to the electromotive

forces generated.

3.6.6

Interference from Light (such as Ultraviolet Rays, Sunlight, Fluorescent

Lamps, Incandescent Lamps)

Light striking a semiconductor device generates electromotive force due to photoelectric effects, sometimes

causing malfunction. Devices in which the chip is visible through the package are especially affected by such

light. When designing the circuits, make sure that the devices are protected against light interference. Not just

optical semiconductor devices, but all types of devices are affected by light.

3.6.7

Dust and Oil

Similar to corrosive gases, dust and oil cause chemical reactions in semiconductor products, sometimes

adversely affecting product characteristics. Be sure to use semiconductor products in an environment that will

not result in dust or oil adhesion. Solvent and oil contained in heat release sheets similarly may result in

semiconductor product quality deterioration, characteristic deterioration or disconnection. Be sure to use such

products with care.

TMPR4956C Datasheet(PDF) 41 Page - Toshiba Semiconductor