TMPR4956C datasheet(23/286 Pages) TOSHIBA

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Handling Precautions

3. General Safety Precautions and Usage Considerations

This section provides information that will help you gain a better understanding of semiconductor devices so as

to ensure device safety, quality and reliability.

3.1

From Incoming to Shipping

3.1.1

Electrostatic Discharge (ESD)

When handling individual devices, be sure that the environment is protected

against static electricity. Operators should wear anti-static clothing. In addition,

containers and other objects that come in direct contact with devices should be

made of materials that do not produce static electricity that would cause damage.

Please follow the precautions below. This is particularly important for those

devices marked “Be careful of static.”

3.1.1.1

Work Environment Control

(1) When humidity decreases, static electricity readily occurs due to friction. Taking into consideration the fact

that moisture-proof-packed products absorb moisture after unpacking, the recommended humidity is 40 to

60%.

(2) Be sure that all equipment such as jigs and tools installed in the work area are grounded.

(3) Place a conductive mat over the floor of the work area or take other measure to ensure that the floor is

protected against static electricity and is grounded to the earth. (Resistance between surface and ground: 1 x

109

Ω or less)

(4) Place a conductive mat over the surface of worktables to ensure that the tables are grounded. (Resistance

between surface and ground: 7.5 x 105 to 1 x 109

Ω) Do not construct worktable surfaces of metallic

materials. Metallic materials are low in resistance, allowing rapid discharge when a charged device comes

in contact with them directly.

(5) Observe the following when using automated equipment:

(a) When picking up a device with a vacuum, use conductive rubber in sections which come into contact

with the device surface to protect against electrostatic charge.

(b) Avoid friction on the device surface to the extent possible. If rubbing is unavoidable due to the

device’s mechanical structure, minimize the friction plane or use material with a small friction

coefficient and low electrical resistance. Also, prevent electrostatic charge by using an ionizer.

or terminals.

(d) Ensure that no statically charged bodies (such as work clothes or the human body) come in contact

with the devices.

(e) Use a tape carrier that employs a low-resistance material on sections that come in contact with

TMPR4956C Datasheet(PDF) 23 Page - Toshiba Semiconductor