TMPR4956C datasheet(25/286 Pages) TOSHIBA

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Handling Precautions

(7) Ensure, to the extent possible, that any articles (such as clipboards) which are brought to a static electricity

control area are constructed of anti-static materials.

(8) When the human body is to come in direct contact with a device, wear anti-static finger covers or gloves.

(9) The material of equipment safety covers located near devices should have a resistance rating of 1 x 109

Ω or

less.

(10) If a wrist strap cannot be used and there is a possibility of imparting friction to devices, use an ionizer.

(11) The transport film used in tape carrier products is manufactured from materials in which static electricity

readily builds up. When using these products, use an ionizer to prevent the film from being charged. Also,

to ensure than no static electricity will be applied to the copper foil area, take measures to prevent

electrostatic discharge failure of peripheral equipment.

3.1.2

Vibration, Impact and Stress

Handle devices and packaging with care. Dropping or applying impact to

devices or packaging causes device damage. Ensure that devices and packaging

are not subjected to mechanical vibration or impact to the extent possible.

Hollow canister-type devices and ceramic sealed devices contain unsecured

wires, making them more susceptible to vibration and impact than plastic

sealed devices.

When a location such as a soldered area, connecting area or top surface of a device is subjected to vibration,

impact or stress in actual equipment, bonding fault or device destruction may result. Therefore, be sure to keep

this in mind at the time of structural design. If a device is subject to especially strong vibration, impact or stress,

the package or chip may crack. If stress is applied to a semiconductor chip through the package, changes in the

resistance of the chip may result due to piezoelectric effects, resulting in fluctuation in element characteristics.

Furthermore, if a stress that does not instantly result in damage is applied continually for a long period of time,

product deformation may result, causing defects such as disconnection or element failure. Thus, at the time of

structural design, carefully consider vibration, impact and stress.

3.2

Storage

3.2.1

General Packaged Products

(1) Avoid storage locations where devices may be exposed to

moisture or direct sunlight.

(2) Follow the precautions printed on the packing label of the

device for transportation and storage.

(3) Keep the storage location temperature and humidity within a

range of 5

°C to 35°C and 45% to 75%, respectively.

Vibration

Humidity:

Temperature:

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