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STA333BW Datasheet(PDF) 61 Page - STMicroelectronics

Part # STA333BW
Description  2.1-channel high-efficiency digital audio system
PDF  64 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STA333BW Datasheet(HTML) 61 Page - STMicroelectronics

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STA333BW
Package thermal characteristics
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8
Package thermal characteristics
Using a double-layer PCB the thermal resistance junction to ambient with 2 copper ground
area of 3x3 cm and with 16 via holes (see Figure 22) is 24 °C/W in natural air convection.
The dissipated power within the device depends primarily on the supply voltage, load
impedance and output modulation level.
The estimated maximum dissipated power for the STA333BW is:
Figure 22.
Double layer PCB Rth j-amb with 2 GND copper area and with 16 via holes
Figure 23 shows the power derating curve for the PSSO36 package with PCB copper areas
of 2 x 2 cm and 3 x 3 cm.
Figure 23.
PSSO36 power derating curve
2 x 20 W into 8
Ω, 18 V
Pd max ~ 4 W
2 x 10 W + 1 x 20 W into 4
Ω, 8 Ω, 18 V
Pd max < 5 W
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Pd (W)
Tamb ( °C)
Copper Area 2x2 cm
and via holes
STA333BW
PSSO36
Copper Area 3x3 cm
and via holes
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Pd (W)
Tamb ( °C)
Copper Area 2x2 cm
and via holes
STA333BW
PSSO36
Copper Area 3x3 cm
and via holes



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