SE97TP datasheet(2/55 Pages) NXP

2 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

2 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

The SE97 has a single die for both the temp sensor and EEPROM for higher reliability and

supports the industry-standard 2-wire I2C-bus/SMBus serial interface. The SMBus

TIMEOUT function is supported to prevent system lock-ups. Manufacturer and Device ID

registers provide the ability to confirm the identity of the device. Three address pins allow

up to eight devices to be controlled on a single bus.

Features

2.1 General features

JEDEC (JC-42.4) TSE 2002B3 DIMM

± 0.5 °C (typ.) between 75 °C and 95 °C

temperature sensor plus 256-byte serial EEPROM for Serial Presence Detect (SPD)

Optimized for voltage range: 3.0 V to 3.6 V, but SPD can be read down to 1.7 V

Shutdown current: 0.1

μA (typ.) and 5.0 μA (max.)

2-wire interface: I2C-bus/SMBus compatible, 0 Hz to 400 kHz

SMBus ALERT Response Address and TIMEOUT (programmable)

ESD protection exceeds 2500 V HBM per JESD22-A114, 250 V MM per

JESD22-A115, and 1000 V CDM per JESD22-C101

Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

Available packages: TSSOP8, HVSON8, HXSON8, HWSON8 (JEDEC PSON8

VCED-3)

2.2 Temperature sensor features

11-bit ADC Temperature-to-Digital converter with 0.125

°C resolution

Operating current: 250

μA (typ.) and 400 μA (max.)

Programmable hysteresis threshold: off, 0

°C, 1.5 °C, 3 °C, 6 °C

Over/under/critical temperature EVENT output

B grade accuracy:

±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C

±1.0 °C/±2 °C (typ./max.) → +40 °C to +125 °C

±2.0 °C/±3 °C (typ./max.) →−40 °C to +125 °C

2.3 Serial EEPROM features

Operating current:

Write

→ 0.6 mA (typ.) for 3.5 ms (typ.)

Read

→ 100 μA (typ.)

Organized as 1 block of 256 bytes [(256

× 8) bits]

100,000 write/erase cycles and 10 years of data retention

Permanent and Reversible Software Write Protect

Software Write Protection for the lower 128 bytes

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