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SE97TP Datasheet(PDF) 6 Page - NXP Semiconductors |
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SE97TP Datasheet(HTML) 6 Page - NXP Semiconductors |
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6 / 55 page  SE97_7 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 29 January 2010 6 of 55 NXP Semiconductors SE97 DDR memory module temp sensor with integrated SPD, 3.3 V 6.2 Pin description Table 2. Pin description Symbol Pin Type Description A0 1 I I2C-bus/SMBus slave address bit 0 with internal pull-down. This input is overvoltage tolerant to support software write protection. A1 2 I I2C-bus/SMBus slave address bit 1 with internal pull-down A2 3 I I2C-bus/SMBus slave address bit 2 with internal pull-down VSS 4 ground device ground SDA 5 I/O SMBus/I2C-bus serial data input/output (open-drain). Must have external pull-up resistor. SCL 6 I SMBus/I2C-bus serial clock input/output (open-drain). Must have external pull-up resistor. EVENT 7 O Thermal alarm output for high/low and critical temperature limit (open-drain). Must have external pull-up resistor. VDD 8 power device power supply (3.0 V to 3.6 V); supports 1.7 V for EEPROM read only. |
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