SE97TP datasheet(52/55 Pages) NXP

52 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

52 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

14. Abbreviations

MSL: Moisture Sensitivity Level

Fig 46. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 33.

Abbreviations

Acronym

Description

ADC

Analog-to-Digital Converter

ARA

Alert Response Address

CDM

Charged-Device Model

CMOS

Complementary Metal-Oxide Semiconductor

CPU

Central Processing Unit

DDR

Double Data Rate

DIMM

Dual In-line Memory Module

DRAM

Dynamic Random Access Memory

ECC

Error-Correcting Code

EEPROM

Electrically Erasable Programmable Read-Only Memory

ESD

ElectroStatic Discharge

HBM

Human Body Model

I2C-bus

Inter-Integrated Circuit bus

LSB

Least Significant Bit

Machine Model

MSB

Most Significant Bit

Personal Computer

PCB

Printed-Circuit Board

POR

Power-On Reset

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