SE97TP datasheet(53/55 Pages) NXP

53 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

53 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

15. Revision history

RDIMM

Registered Dual In-line Memory Module

SMBus

System Management Bus

SO-DIMM

Small Outline Dual In-line Memory Module

SPD

Serial Presence Detect

Table 33.

Abbreviations …continued

Acronym

Description

Table 34.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

SE97_7

20100129

Product data sheet

SE97_6

Modifications:

• Table 1 “Ordering information”:

– added Type number SE97TP/S900

– added Table note [3]

• Added (new) Figure 6 “Pin configuration for HWSON8 (SOT1069-2)”

• Section 7.7 “SMBus time-out”, 1st paragraph, second sentence: changed from “between 25 ns and

35 ms” to “between 25 ms and 35 ms”

• Table 8 “Register summary”, address 07h (Device ID/Revision register):

– Default state is split: A200h for SE97PW, SE97TK; A201h for SE97TP, SE97TL

• Section 8.8 “Device ID register”:

– 1st paragraph, 1st sentence: changed from “The SE97 device ID is A1h.” to “The SE97 device ID

is A2h.”

– Table note [1] modified

• Added (new) Figure 45 “Package outline SOT1069-2 (HWSON8)”

SE97_6

20090817

Product data sheet

SE97_5

20090806

Product data sheet

SE97_4

20090130

Product data sheet

SE97_3

20080715

Product data sheet

SE97_2

20071012

Product data sheet

SE97_1

20070524

Objective data sheet

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