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AMPL138ZCE3 Datasheet(PDF) 119 Page - Texas Instruments

Part # AMPL138ZCE3
Description  OMAP-L138 Low-Power Applications Processor
PDF  268 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AMPL138ZCE3 Datasheet(HTML) 119 Page - Texas Instruments

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6.11.3.5 DDR2/mDDR Keep Out Region
A1
A1
DDR2/mDDR
Device
RegionshouldencompassallDDR2/mDDRcircuitryandvaries
dependingonplacement.Non-DDR2/mDDRsignalsshouldnotbe
routedontheDDRsignallayerswithintheDDR2/mDDRkeepout
region.Non-DDR2/mDDRsignalsmayberoutedintheregion
providedtheyareroutedonlayersseparatedfromDDR2/mDDR
signallayersbyagroundlayer.Nobreaksshouldbeallowedinthe
referencegroundlayersinthisregion.Inaddition,the1.8Vpower
planeshouldcovertheentirekeepoutregion.
OMAP-L138 Low-Power Applications Processor
www.ti.com
SPRS586A – JUNE 2009 – REVISED AUGUST 2009
The region of the PCB used for the DDR2/mDDR circuitry must be isolated from other signals. The
DDR2/mDDR keep out region is defined for this purpose and is shown in Figure 6-21. The size of this
region varies with the placement and DDR routing. Additional clearances required for the keep out region
are shown in Table 6-29.
Figure 6-21. DDR2/mDDR Keepout Region
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Peripheral Information and Electrical Specifications
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