56F807 datasheet(48/60 Pages) FREESCALE

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56F807 Technical Data Technical Data, Rev. 16

Freescale Semiconductor

Part 4 Packaging

4.1 Package and Pin-Out Information 56F807

This section contains package and pin-out information for the 56F807. This device comes in two case

types: low-profile quad flat pack (LQFP) or mold array process ball grid assembly (MAPBGA).

Figure 4-1 shows the package outline for the LQFP case, Figure 4-2 shows the mechanical parameters

for the LQFP case, and Table 4-1 lists the pinout for the LQFP case. Figure 4-3 shows the mechanical

parameters for the MAPBGA case, and Table 4-2 lists the pinout for the MAPBGA package.

Figure 4-1 Top View, 56F807 160-pin LQFP Package

VDD

A10

A11

A12

A13

A14

A15

VSS

D10

VDD

D11

D12

Pin 1

Orientation Mark

121

D13

D14

D15

GPIOB0

ANB7

ANB6

ANB5

ANB4

ANB3

ANB2

ANB1

ANB0

VSSA

VDDA

VREF2

ANA7

ANA6

ANA5

ANA4

ANA3

ANA2

ANA1

ANA0

VSSA

VDDA

VREF

RESET

RSTO

VDD

VSS

VDD

EXTAL

XTAL

VSS

VDD

VDDA

VSSA

EXTBOOT

FAULTA3

FAULTA2

FAULTA1

FAULTA0

PWMA5

56F807 Datasheet(PDF) 48 Page - Freescale Semiconductor, Inc

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