56F807 datasheet(52/60 Pages) FREESCALE

52 / 60 page

56F807 Technical Data Technical Data, Rev. 16

Freescale Semiconductor

Figure 4-3 160 MAPBGA Mechanical Information

Please see www.freescale.com for the most current case outline.

NOTES:

DIMENSIONS ARE IN MILLIMETERS.

INTERPRET DIMENSIONS AND

TOLERANCES PER ASME Y14.5M, 1994.

DIMENSION b IS MEASURED AT THE

MAXIMUM SOLDER BALL DIAMETER,

PARALLEL TO DATUM PLANE Z.

DATUM Z (SEATING PLANE) IS DEFINED BY

THE SPHERICAL CROWNS OF THE SOLDER

BALLS.

PARALLELISM MEASUREMENT SHALL

EXCLUDE ANY EFFECT OF MARK ON TOP

SURFACE OF PACKAGE.

CASE 1268-01

ISSUE O

0.20

LASER MARK FOR PIN 1

IDENTIFICATION IN

THIS AREA

13X

0.15 Z

0.30 Z

ROTATED 90 CLOCKWISE

DETAIL K

VIEW M-M

13X

0.30

0.10 Z

160X

METALIZED MARK FOR

PIN 1 IDENTIFICATION

IN THIS AREA

12 11 10

160X

DIM MIN

MAX

MILLIMETERS

1.32

1.75

0.27

0.47

1.18 REF

0.35

0.65

15.00 BSC

1.00 BSC

0.50 BSC

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