| Electronic Components Datasheet Search |
|
LPC1313 Datasheet(PDF) 56 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
LPC1313 Datasheet(HTML) 56 Page - NXP Semiconductors |
|
56 / 62 page ![]() LPC1311_13_42_43 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 10 August 2010 56 of 62 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Fig 33. Package outline (HVQFN33) References Outline version European projection Issue date IEC JEDEC JEITA - - - hvqfn33_po 09-03-17 09-03-23 Unit mm max nom min 1.00 0.85 0.80 0.05 0.02 0.00 0.2 7.1 7.0 6.9 4.85 4.70 4.55 7.1 7.0 6.9 0.65 4.55 0.75 0.60 0.45 0.1 A(1) Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm A1 b 0.35 0.28 0.23 cD(1) Dh E(1) Eh 4.85 4.70 4.55 ee1 e2 4.55 Lv 0.1 w 0.05 y 0.08 y1 0 2.5 5 mm scale terminal 1 index area B A D E C y C y1 X detail X A1 A c b e2 e1 e e A C B v C w terminal 1 index area Dh Eh L 9 16 32 33 25 17 24 8 1 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |