AD5433 datasheet(28/32 Pages) AD

28 / 32 page

AD5424/AD5433/AD5445

Rev. B | Page 28 of 32

OUTLINE DIMENSIONS

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 63. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-153-AC

6.40 BSC

4.50

4.40

4.30

PIN 1

6.60

6.50

6.40

SEATING

PLANE

0.15

0.05

0.30

0.19

0.65

BSC

1.20 MAX

0.20

0.09

0.75

0.60

0.45

8°

0°

COPLANARITY

0.10

Figure 64. 20-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-20)

Dimensions shown in millimeters

3.75

BCS SQ

4.00

BSC SQ

COMPLIANT

TO JEDEC STANDARDS MO-220-VGGD-1

0.50

BSC

PIN 1

INDICATOR

0.75

0.60

0.50

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

2.25

2.10 SQ

1.95

EXPOSED

PAD

(BOTTOM VIEW)

0.60 MAX

0.25 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 65. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-20-1)

Dimensions shown in millimeters

AD5433 Datasheet(PDF) 28 Page - Analog Devices

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