Z560 datasheet(9/73 Pages) INTEL

9 / 73 page

Introduction

Datasheet

1.3

Terminology

Term

Definition

A “#” symbol after a signal name refers to an active low signal, indicating

a signal is in the active state when driven to a low level. For example,

when RESET# is low, a reset has been requested. Conversely, when NMI

is high, a non-maskable interrupt has occurred. In the case of signals

where the name does not imply an active state but describes part of a

binary sequence (such as address or data), the “#” symbol implies that

the signal is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’,

and D[3:0]# = “LHLH” also refers to a hex “A” (H= High logic level,

L= Low logic level).

Front Side Bus

(FSB)

Refers to the interface between the processor and system core logic (also

known as the Intel® SCH chipset components).

AGTL+

Advanced Gunning Transceiver Logic is used to refer to Assisted GTL+

signaling technology on some Intel processors.

Intel® Burst

Performance

Technology

(Intel® BPT)

Enables on-demand performance, without impacting or raising MID

thermal design point.

BFM

Burst Frequency Mode

CMOS

Complementary Metal-Oxide Semiconductor

Storage

Conditions

Refers to a non-operational state—the processor may be installed in a

platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor landings should

not be connected to any supply voltages, or have any I/Os biased, or

receive any clocks. Upon exposure to “free air” (that is, unsealed

packaging or a device removed from packaging material) the processor

must be handled in accordance with moisture sensitivity labeling (MSL)

as indicated on the packaging material.

Enhanced Intel

SpeedStep®

Technology

Technology that provides power management capabilities to low power

devices.

Processor Core

Processor core die with integrated L1 and L2 cache. All AC timing and

signal integrity specifications are at the pads of the processor core.

Intel

Virtualization

Technology

Processor virtualization which when used in conjunction with Virtual

Machine Monitor software enables multiple, robust independent software

environments inside a single platform.

TDP

Thermal Design Power

VCC

The processor core power supply.

Voltage Regulator

VSS

The processor ground

VCCHFM

VCC at Highest Frequency Mode (HFM)

VCCLFM

VCC at Lowest Frequency Mode (LFM)

Z560 Datasheet(PDF) 9 Page - Intel Corporation

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