SE98ATP datasheet(35/43 Pages) NXP

35 / 43 page

SE98A_4

Product data sheet

Rev. 04 — 25 November 2009

35 of 43

NXP Semiconductors

SE98A

DDR memory module temp sensor, 1.7 V to 3.6 V

12. Package outline

Fig 28. Package outline SOT530-1 (TSSOP8)

UNIT

max.

D(1)

E(2)

Z(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.95

0.85

0.30

0.19

0.20

0.13

3.1

2.9

4.5

4.3

0.65

6.5

6.3

0.70

0.35

0.1

0.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.5

SOT530-1

MO-153

00-02-24

03-02-18

w M

0.25

(A3)

detail X

v M A

2.5

5 mm

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm

SOT530-1

1.1

pin 1 index

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