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SE98ATP Datasheet(PDF) 43 Page - NXP Semiconductors |
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SE98ATP Datasheet(HTML) 43 Page - NXP Semiconductors |
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43 / 43 page  NXP Semiconductors SE98A DDR memory module temp sensor, 1.7 V to 3.6 V © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 November 2009 Document identifier: SE98A_4 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.3 EVENT output condition . . . . . . . . . . . . . . . . . . 6 7.3.1 EVENT pin output voltage levels and resistor sizing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.3.2 EVENT thresholds . . . . . . . . . . . . . . . . . . . . . . 8 7.3.2.1 Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.3.2.2 Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.3.3 Event operation modes. . . . . . . . . . . . . . . . . . . 9 7.3.3.1 Comparator mode. . . . . . . . . . . . . . . . . . . . . . . 9 7.3.3.2 Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.4 Conversion rate . . . . . . . . . . . . . . . . . . . . . . . 10 7.4.1 What temperature is read when conversion is in progress . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.5 Power-up default condition . . . . . . . . . . . . . . . 11 7.6 Device initialization . . . . . . . . . . . . . . . . . . . . . 11 7.7 SMBus Time-out . . . . . . . . . . . . . . . . . . . . . . . 12 7.8 SMBus ALERT . . . . . . . . . . . . . . . . . . . . . . . . 12 7.9 SMBus/I2C-bus interface . . . . . . . . . . . . . . . . 13 7.10 Hot plugging . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8 Register descriptions . . . . . . . . . . . . . . . . . . . 16 8.1 Register overview . . . . . . . . . . . . . . . . . . . . . . 16 8.2 Capability register (00h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 17 8.3 Configuration register (01h, 16-bit read/write) . . . . . . . . . . . . . . . . . . 18 8.4 Temperature format . . . . . . . . . . . . . . . . . . . . 21 8.5 Temperature Trip Point registers . . . . . . . . . . 22 8.5.1 Upper Boundary Alarm Trip register (16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 22 8.5.2 Lower Boundary Alarm Trip register (16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 23 8.5.3 Critical Alarm Trip register (16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 23 8.6 Temperature register (16-bit read-only) . . . . . 24 8.7 Manufacturer’s ID register (16-bit read-only) . . . . . . . . . . . . . . . . . . . . . . 25 8.8 Device ID register . . . . . . . . . . . . . . . . . . . . . 25 8.9 SMBus register . . . . . . . . . . . . . . . . . . . . . . . 26 9 Application design-in information . . . . . . . . . 27 9.1 SE98A in memory module application . . . . . . 28 9.2 Layout consideration . . . . . . . . . . . . . . . . . . . 28 9.3 Thermal considerations . . . . . . . . . . . . . . . . . 28 10 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 29 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 29 12 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 35 13 Soldering of SMD packages . . . . . . . . . . . . . . 38 13.1 Introduction to soldering. . . . . . . . . . . . . . . . . 38 13.2 Wave and reflow soldering. . . . . . . . . . . . . . . 38 13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 38 13.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 39 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . 41 16 Legal information . . . . . . . . . . . . . . . . . . . . . . 42 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 42 16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 42 16.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42 17 Contact information . . . . . . . . . . . . . . . . . . . . 42 18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 |
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