SE98ATP datasheet(40/43 Pages) NXP

40 / 43 page

SE98A_4

Product data sheet

Rev. 04 — 25 November 2009

40 of 43

NXP Semiconductors

SE98A

DDR memory module temp sensor, 1.7 V to 3.6 V

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

14. Abbreviations

MSL: Moisture Sensitivity Level

Fig 31. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 30.

Abbreviations

Acronym

Description

ADC

Analog-to-Digital Converter

ARA

Alert Response Address

BIOS

Basic Input/Output System

CDM

Charged-Device Model

CMOS

Complementary Metal-Oxide Semiconductor

CPU

Central Processing Unit

CRWP

Clear Reversible Write Protection

DDR

Double Data Rate

DDR2

Double Data Rate 2

DDR3

Double Data Rate 3

DIMM

Dual In-line Memory Module

DRAM

Dynamic Random Access Memory

ESD

ElectroStatic Discharge

HBM

Human Body Model

I2C-bus

Inter IC bus

I/O

Input/Output

LSB

Least Significant Bit

Machine Model

MSB

Most Significant Bit

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