AM3359 datasheet(159/195 Pages) TI

159 / 195 page

DDR3

Interface

AM3359, AM3358, AM3357

AM3356, AM3354, AM3352

www.ti.com

SPRS717B

– OCTOBER 2011 – REVISED JANUARY 2012

5.4.2.3.3.4 Placement

Figure 5-44 shows the required placement for the AM335x device as well as the DDR3 devices. The

dimensions for this figure are defined in Table 5-54. The placement does not restrict the side of the PCB

on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace

lengths and allow for proper routing space.

Figure 5-44. Placement Specifications

Table 5-54. Placement Specifications(1)

NO.

PARAMETER

MIN

MAX

UNIT

X1(2)(3)(4)

1000

mils

X2(2)(3)

600

mils

Y Offset(2)(3)(4)

1500

mils

Clearance from non-DDR3 signal to DDR3 keepout region(5)(6)

(1) DDR3 keepout region to encompass entire DDR3 routing area.

(2) For dimension definitions, see Figure 5-44.

(3) Measurements from center of AM335x device to center of DDR3 device.

(4) Minimizing X1 and Y improves timing margins.

(5) w is defined as the signal trace width.

(6) Non-DDR3 signals allowed within DDR3 keepout region provided they are separated from DDR3 routing layers by a ground plane.

Peripheral Information and Timings

159

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AM3359 Datasheet(PDF) 159 Page - Texas Instruments