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ADSP-TS101S Datasheet(PDF) 44 Page - Analog Devices

Part # ADSP-TS101S
Description  TigerSHARC Embedded Processor
PDF  48 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADSP-TS101S Datasheet(HTML) 44 Page - Analog Devices

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Rev. C
|
Page 44 of 48
|
May 2009
ADSP-TS101S
SURFACE-MOUNT DESIGN
The following table is provided as an aide to PCB design.
For industry-standard design recommendations, refer to
IPC-7351, Generic Requirements for Surface-Mount Design
and Land Pattern Standard.
Figure 44. 625-Ball PBGA (B-625)
1.00
BSC
SQ
BALL
PITCH
0.70
0.60
0.50
BALL DIAMETER
24.20
24.00
23.80
2.50 MAX
DETAIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.25 mm OF ITS
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE NOMINAL.
4. THIS PACKAGE COMPLIES WITH THE JEDEC MS-034 SPECIFICATION,
BUT USES TIGHTER TOLERANCES THAN THE MAXIMUMS ALLOWED IN
THAT SPECIFICATION.
SEATING PLANE
1.25 MAX
0.20 MAX
DETAIL A
0.65
0.55
0.45
0.40 MIN
27.20
27.00 SQ
26.80
7
95
3
1
11
13
15
17
21 19
23
25
6
8
10
12
14
16
18
20
24 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AE
AD
AC
AB
AA
24.00
BSC
SQ
24.20
24.00
23.80
27.20
27.00
26.80
27.20
27.00
26.80
TOP VIEW
BOTTOM VIEW
1.50
BSC
SQ
1.50
BSC
SQ
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
625-ball (27 mm) PBGA
Solder Mask Defined (SMD)
0.45 mm diameter
0.60 mm diameter
484-ball (19 mm) PBGA
Solder Mask Defined (SMD)
0.40 mm diameter
0.53 mm diameter



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