Tsi721 Datasheet

3

May 5, 2014

Formal Status

This document is confidential and is subject to an NDA.

Integrated Device Technology

Table of Contents

About this Document......................................................................................................................7

Overview.................................................................................................................................................................................................... 7

Document Conventions.............................................................................................................................................................................. 7

Revision History......................................................................................................................................................................................... 8

1.

Device Overview.......................................................................................................................... 10

1.1

Overview.................................................................................................................................................................................................. 10

1.2

Features................................................................................................................................................................................................... 10

1.2.1

PCIe Features .......................................................................................................................................................................... 10

1.2.2

S-RIO Features .........................................................................................................................................................................11

1.2.3

Bridging Features ......................................................................................................................................................................11

1.2.4

Messaging Features................................................................................................................................................................. 12

1.2.5

Block DMA Engine Features .................................................................................................................................................... 12

1.2.6

Miscellaneous Features............................................................................................................................................................ 13

1.3

Block Diagram.......................................................................................................................................................................................... 14

1.3.1

PCIe Interface........................................................................................................................................................................... 14

1.3.2

S-RIO Interface......................................................................................................................................................................... 14

1.3.3

Messaging Engine.................................................................................................................................................................... 14

1.3.4

Mapping Engine........................................................................................................................................................................ 14

1.3.5

Block DMA Engine.................................................................................................................................................................... 14

1.4

Typical Applications ................................................................................................................................................................................. 15

1.4.1

Defense/Aerospace Application ............................................................................................................................................... 15

1.4.2

Video and Imaging Application ................................................................................................................................................. 17

1.4.3

Wireless Application ................................................................................................................................................................. 17

2.

Signals ......................................................................................................................................... 19

2.1

Overview.................................................................................................................................................................................................. 19

2.2

Ballmap.................................................................................................................................................................................................... 20

2.3

Pinlist ....................................................................................................................................................................................................... 21

2.4

PCIe Signals ............................................................................................................................................................................................ 21

2.5

S-RIO Signals .......................................................................................................................................................................................... 22

2.6

General Signals ....................................................................................................................................................................................... 22

2.7

I2C Signals .............................................................................................................................................................................................. 23

2.8

JTAG and Test Interface Signals.............................................................................................................................................................. 23

2.9

GPIO Signals ........................................................................................................................................................................................... 24

2.10 Power-up Signals..................................................................................................................................................................................... 25

2.11

Power Supply Signals.............................................................................................................................................................................. 28

3.

Electrical Characteristics........................................................................................................... 29

3.1

Absolute Maximum Ratings ..................................................................................................................................................................... 29

3.2

Recommended Operating Conditions...................................................................................................................................................... 30

3.3

Power Consumption................................................................................................................................................................................. 30

3.4

Power Supply Sequencing....................................................................................................................................................................... 31

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