Table of Contents

Tsi721 Datasheet

4

May 5, 2014

Formal Status

This document is confidential and is subject to an NDA.

Integrated Device Technology

3.4.1

Power-Up Sequencing.............................................................................................................................................................. 31

3.4.2

Power-Down Sequencing......................................................................................................................................................... 31

3.5

DC Operating Characteristics .................................................................................................................................................................. 32

3.6

Decoupling Recommendation.................................................................................................................................................................. 33

3.7

AC Timing Specifications......................................................................................................................................................................... 33

3.7.1

PCIe Differential Receiver Specifications ................................................................................................................................. 33

3.7.2

PCIe Differential Transmitter Specifications ............................................................................................................................. 36

3.7.3

RapidIO SerDes Characteristics............................................................................................................................................... 40

3.7.4

Level I Long Run Transmitter Specifications ............................................................................................................................ 45

3.7.5

Reference Clocks – PCCLKP/N and REFCLKP/N................................................................................................................... 59

3.7.6

JTAG and Test Interface Signal Timings .................................................................................................................................. 61

3.7.7

I2C Interface Signal Timings .................................................................................................................................................... 62

3.7.8

GPIO Interface Signal Timings ................................................................................................................................................. 63

3.7.9

RSTn Signal Timings................................................................................................................................................................ 63

4.

Package Specifications............................................................................................................... 64

4.1

Package Dimensions ............................................................................................................................................................................... 64

4.2

Package Diagrams................................................................................................................................................................................... 65

4.3

Thermal Characteristics........................................................................................................................................................................... 66

4.4

Moisture Sensitivity.................................................................................................................................................................................. 66

5.

Ordering Information................................................................................................................... 67