HCPL316J datasheet(32/33 Pages) HP

32 / 33 page

Printed Circuit Board

Layout Considerations

Adequate spacing should always

be maintained between the high

voltage isolated circuitry and any

input referenced circuitry. Care

must be taken to provide the

same minimum spacing between

two adjacent high-side isolated

regions of the printed circuit

board. Insufficient spacing will

reduce the effective isolation and

increase parasitic coupling that

will degrade CMR performance.

The placement and routing of

supply bypass capacitors requires

special attention. During switch-

ing transients, the majority of the

gate charge is supplied by the

bypass capacitors. Maintaining

short bypass capacitor trace

lengths will ensure low supply

ripple and clean switching

waveforms.

Ground Plane connections are

necessary for pin 4 (GND1) and

pins 9 and 10 (VEE) in order to

achieve maximum power

dissipation as the HCPL-316J is

designed to dissipate the majority

of heat generated through these

pins. Actual power dissipation

will depend on the application

environment (PCB layout, air

flow, part placement, etc.) See

the Thermal Model section for

details on how to estimate

junction temperature.

The layout examples below have

good supply bypassing and

thermal properties, exhibit small

PCB footprints, and have easily

connected signal and supply

lines. The four examples cover

single sided and double sided

component placement, as well as

minimal and improved

performance circuits.

Figure 79. Recommended Layout(s).

HCPL316J Datasheet(PDF) 32 Page - Agilent(Hewlett-Packard)

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