TDP158 datasheet(6/55 Pages) TI1

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TDP158

SLLSEX2 – DECEMBER 2016

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Recommended Operating Conditions (continued)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIH

High-level input voltage at OE, A1/EQ2, A0/EQ1, TERM, I2C_EN, SLEW

pins only

2.2

High-level input voltage at SDA_SRC, SCL_SRC, SDA_CTL/PRE,

SCL_CTL/SWAP

0.7 x VCC

High-level input voltage at SDA_SNK, SCL_SNK

2.9

High-level input voltage at HPD

VOL

Low-level output voltage

0.4

VOH

High-level output voltage

2.4

fSCL

SCL clock frequency fast I2C mode for local I2C control

400

kHz

C(bus,DDC)

Total capacitive load for each bus line supporting 400 kHz (DDC

terminals)

400

C(bus,I2C)

Total capacitive load for each bus line (local I2C terminals)

100

dR(DDC)

DDC Data rate

400

kbps

IIH

High level input current

–30

µA

IIM

Mid level input current

–20

µA

IIL

Low level input current

–10

µA

IOZ

High impedance outpupt current

µA

R(OEPU)

Pull up resistance on OE pin

150

250

Ω

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TDP158

UNIT

RSB (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

3.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

23.1

°C/W

RθJB

Junction-to-board thermal resistance

9.9

°C/W

ψJT

Junction-to-top characterization parameter

0.3

°C/W

ψJB

Junction-to-board characterization parameter

3.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.2

°C/W

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